A Real-Time X-Ray is a technique used to inspect semiconductor components during their manufacturing process, particularly during packaging or assembly. This technology allows for the non-destructive inspection of semiconductor devices, enabling manufacturers to identify issues such as:
- Internal defects: Cracks, voids, or misalignments inside the chip or package.
- Wire bonding issues: Problems with the interconnection between different components, such as incorrect bonding of wires or leads.
- Package integrity: Ensuring that the protective package around the chip is properly sealed and free from defects that could affect performance.
In real-time X-ray inspection, an X-ray machine takes continuous images of the semiconductor components during the production process, allowing operators to monitor the quality of the devices as they are being made. This method is particularly valuable because it provides immediate feedback on potential defects without having to destructively test or disassemble the device.
The advantage of using real-time X-ray for semiconductor inspection includes:
- Non-destructive testing: The chips can be inspected without damaging them.
- High resolution: It offers high-resolution imaging to detect minute defects.
It’s commonly used in advanced semiconductor packaging and quality control processes.
