Mechanical probing is a process used to test and characterize the electrical properties of semiconductor devices, typically during the fabrication or failure analysis stages. It involves using a set of specialized probes to make contact with specific points on a semiconductor wafer or device to measure electrical signals such as voltage, current, or resistance.
Here’s how it works:
- Probing Station: The device or wafer is placed on a probing station, which holds it in place and aligns it with a set of precision mechanical probes. These probes are typically made of fine metal (like tungsten) and are equipped with tiny tips to make contact with the device’s pads or test points.
- Mechanical Probes: The probes are moved precisely using a system (often controlled by a microscope or automation) to contact the exact locations on the device where electrical measurements are needed. These probes apply a small amount of pressure to make an electrical connection without damaging the device.
- Electrical Measurement: Once contact is made, instruments connected to the probes measure parameters like voltage, current, or resistance. The data collected helps engineers to evaluate the device’s performance, troubleshoot faults, or analyze the integrity of the semiconductor structure.
- Failure Analysis: In the case of faulty or failed devices, mechanical probing can help locate specific issues, like open circuits or shorts, or verify whether certain components are functioning properly.
It’s widely used in semiconductor manufacturing, especially during research and development phases, to ensure the performance and reliability of the devices being produced.
