Decapsulation is a process in electronics manufacturing where the outer package of a semiconductor device (like an integrated circuit) is removed to expose the chip (or die) inside. This process is often done for failure analysis, reverse engineering, or inspection purposes. By decapsulating the die, engineers can examine the internal structure of the chip, its components, and any potential defects that may have caused a malfunction.
The process usually involves using chemicals, heat, or mechanical tools to safely remove the encapsulating material, such as epoxy or plastic, without damaging the delicate silicon die inside.
