Semiconductor Scanning Acoustic Microscopy (SAM) is a non-destructive imaging technique used to inspect the internal structure and quality of semiconductor materials and devices. It employs high-frequency sound waves (ultrasound) to scan and create detailed images of the interior of a semiconductor, often revealing hidden defects, delamination, voids, cracks, or other structural issues that could affect performance or reliability.
Here’s how it works:
- Ultrasonic Wave Generation: A focused ultrasonic transducer is used to generate high-frequency sound waves that are directed into the material under examination.
- Wave Interaction with the Material: As the sound waves travel through the semiconductor, they interact with various interfaces, such as cracks, voids, or material boundaries. The waves can be partially reflected or transmitted, depending on the properties of the material they encounter.
- Detection and Imaging: Reflected sound waves are received by a sensor, and this data is processed to generate an image or a map of the material’s internal structure. The image typically highlights areas of interest, such as defects or inconsistencies in the material, based on how the sound waves were reflected.
Key Benefits of SAM:
- Non-destructive: Since it doesn’t require physical cutting or damage to the semiconductor, it preserves the integrity of the sample.
- High Resolution: It can detect small-scale defects that may not be visible through other inspection methods, such as optical or X-ray imaging.
- Versatile: SAM is used for a variety of applications, including testing integrated circuits, packaging, and other semiconductor devices.
This technique is often applied in the semiconductor industry for quality control, failure analysis, and ensuring the reliability of components before they are used in consumer electronics or other critical systems.
